€140m 3D chip research centre opens in Dresden

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Fraunhofer IPMS and Fraunhofer IZM-ASSID have opened a flagship €140m research centre for 3D chips in Dresden, Germany. The Centre for Advanced CMOS & Heterointegration Saxony will provide the complete value chain for 300 mm wafer technology to build 3D chips and heterogeneous systems using substrates and chiplets. It will...

www.eenewseurope.com, Jun. 08, 2022 – 

Fraunhofer IPMS and Fraunhofer IZM-ASSID have opened a flagship €140m research centre for 3D chips in Dresden, Germany.

The Centre for Advanced CMOS & Heterointegration Saxony will provide the complete value chain for 300 mm wafer technology to build 3D chips and heterogeneous systems using substrates and chiplets. It will also work on ways to build neuromorphic and photonic AI and quantum devices on 300mm CMOS wafers.

The two organisation are the only two German research centres for applied microelectronics research based on 300 mm wafer industry standard equipment, working with semiconductor companies and system users as well as material and equipment manufacturers worldwide.

The centre also aims to tap into funding for the European CHIPS Act which aims to boost semiconductor production across the continent. Dresden is the centre of semiconductor production for Europe, although Intel chose another region in Germany, Madegeburg, for its leading edge fab backed by CHIPS Act funds.

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