- TSMC to Exit GaN, Focus on Advanced Packaging
- Samsung shortsightedly rejected Nvidia CEO Jensen Huang's reported HBM production and Foundry business proposals in 2018
- Siemens and UMC collaborate to advance EM/IR drop analysis with mPower technology
- Europe's photonic computing opportunity: Q.ANT's funding boosts competitive edge
- Rapidus Achieves Significant Milestone at its State-of-the-Art Foundry with Prototyping of Leading-Edge 2nm GAA Transistors
IP-SOC DAYS 2025 IP-SOC DAYS 2024 IP-SOC DAYS 2023 IP-SOC DAYS 2022 IP-SOC DAYS 2021 IP-SOC 2024 IP-SOC 2023 IP-SOC 2022 IP-SOC 2021
|
|||||||
![]() |
|

Intel to manufacture MediaTek Edge chips, instead of TSMC
- Keysight Supports Post-Quantum Cryptography Evaluation (Jul. 24, 2025)
- Mixel Supports Automotive SerDes Alliance (ASA) Motion Link SerDes IP (Jul. 23, 2025)
- TSMC to Exit GaN, Focus on Advanced Packaging (Jul. 23, 2025)
- UMC Announces Software Acquisition and Upcoming Earnings Release (Jul. 23, 2025)
- Arteris Selected by Whalechip for Near-Memory Computing Chip (Jul. 22, 2025)
- See Latest News>>
An early win for Intel Foundry Services
www.datacenterdynamics.com, Jul. 26, 2022 –
Intel's semiconductor foundry division has been awarded a contract to develop smart Edge devices for MediaTek.
The world's fourth largest fabless chip designer, Taiwanese company MediaTek is one of the largest developers of smartphone processors, wireless communications, television chips, and assorted consumer electronics - helping produce two billion devices last year.
The majority of those chips are still made by Taiwan Semiconductor Manufacturing Corporation (TSMC).
"MediaTek is a terrific partner for Intel Foundry Services (IFS) as we enter our next phase of growth," said IFS president Randhir Thakur.
"We have the right combination of advanced process technology and geographically diverse capacity to help MediaTek deliver the next billion connected devices across a range of applications."
The chips will use the 'Intel 16' process, a revamped version of the 22FFL node, designed for low-power devices. While the design of the chips was not disclosed, Intel 16 supports third-party chip design tools, unlike the proprietary design tools that it uses internally.
"With its commitment to major capacity expansions, IFS provides value to MediaTek as we seek to create a more diversified supply chain," said NS Tsai, corporate senior vice president of platform technology and manufacturing operations at MediaTek. "We look forward to building a long-term partnership to serve the fast-growing demand for our products from customers across the globe."
The scale of the order and the delivery timeline were not disclosed.