Intel's new 3D Foveros packaging tech: LEGO-like chiplets for CPUs

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Intel details its 3D Foveros packaging technology: LEGO-style chiplet CPU design for next-gen Meteor Lake, Arrow Lake, Lunar Lake CPUs of the future.

www.tweaktown.com, Aug. 23, 2022 – 

Intel has revealed more details on its upcoming 3D Foveros packaging technology, which it will be using to built its next-gen Meteor Lake, Arrow Lake, and Lunar Lake CPUs of the future.

The company discussed more details on its packaging technology during Hot Chips 34, where we're finding out about all the new exciting GPU technology from the likes of AMD, NVIDIA, Chinese GPU maker Birentech, and more. Intel talked about the work it has been putting into the development of its 14th Gen Core "Meteor Lake" CPUs, with its new 3D Foveros packaging technology.

Intel's new Foveros packaging technology is a next-gen inter-die chiplet packaging technology that Intel will be splitting into 3 different ways: The standard design for high-yield, high-volume production, Foveros Omni that mixes and matches tiles in the base die complex, with up to 4x interconnect bump density, and finally there's Foveros Direct that has 16x interconnect density, with lower latency, higher bandwidth, and lower power/die requirements.

Here are the base specs for Intel's new Foveros offerings:

• Foveros: 50-25um (Bump Pitch), >400-1600/mm2 (Bump Density), 0.156 pJ/bit (Power)
• Foveros Omni: 25um (Bump Pitch), 1600/mm2 (Bump Density), <0.15 pJ/bit (Power)
• Foveros Direct: <10 Microns (Bump Pitch), >10,000/mm2 (Bump Density), <0.05 pJ/bit (Power)

Intel has already made considerable changes with its 12th Gen Core "Alder Lake" and upcoming 13th Gen Core "Raptor Lake" CPUs with its hybrid core architecture, but the new 3D Foveros packaging technology will bring Intel up to where AMD is right now: multi-chiplet designs.

The upcoming Intel 14th Gen Core "Meteor Lake", 15th Gen Core "Arrow Lake", and 16th Gen Core "Lunar Lake" CPUs will be infused with the next-gen 3D Foveros packaging technology.

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