Intel Foundry Services roadmap unveiled one deal at a time

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edn.com, Oct. 25, 2022 – 

Intel Foundry Services (IFS) is making its technology roadmap apparent with each new deal it signs, and the message is clear: Intel means business. Through these deals and partnerships, the Santa Clara, California-based chipmaker is cobbling a chip design and manufacturing ecosystem built around EDA tools and IP offerings made available via cloud platforms.

The latest announcement aims to cement the foundry business with military, aerospace, and government clients, a low-hanging fruit amid its status as a U.S.-based foundry planning to offer chip manufacturing at smaller nanometer nodes. Besides the unique functional requirements such as radiation hardening by design and wide ambient temperature tolerance, IFS will also offer design support via reference flows and methodologies.

Earlier, in summer 2022, IFS unveiled partnerships with cloud service providers like Amazon Web Services (AWS) and Microsoft Azure to facilitate efficient and secure design environments for its foundry clients. The cloud platform will optimize EDA tools to take advantage of the scalability of the cloud while meeting the requirements of Intel's process design kits (PDKs). For that, IFS has signed pacts with EDA tool providers such as Ansys, Cadence, Siemens EDA, and Synopsys.

The production-proven design environments in the cloud will also provide access to Intel's advanced process and packaging technologies. That will shorten design cycles and accelerate time-to-market for chip designers.

IFS is also giving early access to process and packaging roadmaps as well as process design kits (PDKs) to EDA companies like Cadence. That will enable EDA solution providers to fine-tune EDA tools and IPs for Intel's process and packaging technologies portfolio.

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