TSMC Grants a Sweep of EDA Certifications for New Process Nodes

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To ensure that designers have the right tools for the job, TSMC announced a slew of EDA tool certifications for its most advanced processes–ranging from 3 nm nodes to 3D semiconductor integration.

allaboutcircuits.com, Nov. 06, 2022 – 

In a bid to help designers rapidly adopt their advanced processes, Taiwan Semiconductor Manufacturing Company (TSMC) has recently granted a slew of certifications for EDA tools targeting their advanced nodes.

With the release of the N3E, N4P, and 3DFabric processes, new and unique design requirements mandate a new certification to ensure that both the designer's system requirements and TSMC's process requirements are all met to reduce time-to-market.

In this article, a glance at TSMC's advanced processes and their implications will be given, followed by an overview of the certifications granted by TSMC and how these may help future designers.

Keeping the Advancements Coming

TSMC, continuing the trend toward smaller and denser transistors, has previously announced its newest digital nodes, N3E and N4P, to allow designers to keep up the pace in reducing overall IC size, creating more room for additional features on the same size wafer. Both of these nodes are extensions of existing technologies but offer enhanced performance when compared to their original counterparts.

The N3E technology, a 3 nm "enhanced" technology, boasts considerable improvements in speed and power consumption compared to previous technologies. In addition, the freedom to implement the FinFETs in a custom manner regarding feature size allows for optimal tradeoffs to be made regarding speed, area, and efficiency.

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