Chiplet Interconnect Technology Heads Toward Commercialization

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Recently funded startup Eliyan expects to bring its high-performance chiplet interconnect technology to market in 2023.

www.designnews.com, Nov. 08, 2022 – 

The growing interest in chiplet technology for high-performance computing architectures has prompted both development among startup companies in conjunction with increased in funding activity. One such company, Eliyan Corporation, recently closed a Series A $40 million funding round and is set to unleash a chiplet interconnect technology, called NuLink, that achieves high performance using standard organic substrates.

Eliyan was founded by CEO Ramin Farjadrad, the inventor of Bunch of Wires (BoW) scheme, which has been adopted by the Open Compute Project (OCP). NuLink technology is backward compatible with Universal Chiplet Interconnect Express (UCIe), a standard developed by Intel and donated to the UCIe Consortium. According to Farjadrad, the technology achieves similar bandwidth, power efficiency, and latency as die-to-die implementations using advanced packaging technologies, but without the other drawbacks of more specialized approaches.

Eliyan's BoW approach was specifically developed to address the need for highly efficient die-to-die (D2D) PHYs to connect different functions in one package. The NuLink technology, which is a superset of BoW and UCIe, uses patented implementation techniques to provide major power-performance differentiation for D2D connectivity over any packaging substrate, reducing complexity and lowering overall development time and costs.

Farjadrad, in an interview with Design News, said the technology eliminates the need for advanced packaging solutions, most commonly silicon interposers that limit overall system-in-package size that ultimately limits performance. The use of interposers also limits wafer test coverage that ultimately impacts yield, increases total cost of ownership, and extends overall manufacturing cycle time.

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