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Semiconductor Companies Create Building Block for Chiplet Design
www.hpcwire.com/, Jan. 24, 2023 –
Intel's CEO Pat Gelsinger last week made a grand proclamation that chips will be for the next few decades what oil and gas was to the world over the last 50 years.
While that remains to be seen, two technology associations are joining hands to develop building blocks to stabilize the development of future chip designs. The goal of the standard is to set the stage for a thriving marketplace that fuels growth.
The Open Compute Project and JEDEC – two major industry consortiums boasting top tech companies as members – are setting up a standard to support the development of technology that will underpin the manufacturing of chips for computers, cars, factories, medical devices and other equipment.
The conventional way of manufacturing chips, which relied on cramming as much computing and graphics capabilities into smaller chips, has reached physical limitations. These chips are becoming harder to manufacture, which has slowed down advances in chip technology.
Major chipmakers are now taking a new approach with chiplets, which are modules that can be pieced together to construct a chip. Chiplets are like Lego blocks – a customer can mix and match chiplets of their own to build a custom chip.
For example, if a customer wants to build a chip for artificial intelligence, they can piece together chiplets that includes a CPU, a graphics processor, and an artificial intelligence accelerator, and send it over to a chip manufacturer like Intel and TSMC for fabrication.
The chiplet approach is favored over conventional monolithic designs as it provides a way to customize and manufacture chips for industries outside tech and consumer electronics. Chips are emerging as building blocks for industries like automotive, and major auto companies in the last two years had to shut down production of cars due to a shortage of chips.
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