Pushing the System-in-Package Concept Into the Future

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Chipletz selected Siemens semiconductor packaging technologies for the design of their unique Smart Substrate based advanced packages.

www.eetasia.com, Feb. 22, 2023 – 

Incorporated in 2021, Chipletz is a fabless substrate vendor developing advanced packaging technology that bridges the gap between the slowing of Moore's Law and the rising demand for compute performance. The company's Smart Substrate products facilitate multiple ICs in a single package for critical AI workloads, immersive consumer experiences, and high-performance computing.

Based in Austin, Texas, in the United States, Chipletz is targeting delivery of its initial products to its customers and partners in early 2024. Its lineup includes HyperLynx 3D EM, HyperLynx Advanced Solvers, HyperLynx DRC, HyperLynx SI/PI, and Xpedition IC Packaging.

Vision

Chipletz is a funded start-up with industry veterans from Advanced Micro Devices Inc. (AMD) and other major system providers. Their vision is to revolutionize semiconductor in-package functionality through the development of an advanced packaging technology that bridges the gap between the slowing of Moore's Law and the rising demand for compute performance.

Chipletz Smart Substrate products facilitate the heterogeneous integration of multiple ICs in a single package for critical AI workloads, immersive consumer experiences, and high-performance computing. The Chipletz team of skilled engineers have decades of experience in semiconductor design, manufacturing, and packaging to address that need.

Chipletz is pushing the system-in-package (SIP) concept into the future and offering a path forward that will enable years of additional performance increases while resetting the economic model for semiconductor integration. Chipletz makes integration of virtually any die from any manufacturer possible using their unique Smart Substrate based platform.

The Smart Substrate provides die-to-die interconnect and high speed I/O and supports different voltage domains from a single supply, outperforming current multi-chip module and system-in-package options.

"Designing for our Smart Substrate has a number of challenging requirements for designers and their design tools," said Michael Su, CTO at Chipletz. "These were key evaluation drivers for us when we evaluated EDA suppliers and their technologies."

The key selection criteria Chipletz used can be summarized as follows:

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