TSMC on track to roll out advanced 2nm chips by 2025

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Hsinchu, April 27 (CNA) Taiwan Semiconductor Manufacturing Company (TSMC) has announced that plans to bring its advanced 2-nanometer (nm) technology into mass production by 2025 are still on track.

focustaiwan.tw/, Apr. 27, 2023 – 

TSMC is battling to maintain its lead over main rivals Intel and Samsung, which aim to start production of 2nm-class chips in 2024 and 2025, respectively.

TSMC announced the timeline for 2nm production at its North America Technology Symposium in Santa Clara, California, on Wednesday.

According to TSMC, more than 1,600 customers and partners registered to attend the event, the first of an international series of technology symposiums hosted by the world's largest contract chipmaker.

During the event Wednesday, TSMC showcased its latest technology developments, including progress in 2nm technology and new members of its industry-leading 3nm technology family, as well as 3DFabric, a comprehensive family of 3D silicon stacking and advanced packaging technologies.

The company indicated that the development of its 2nm technology, which utilizes nanosheet transistors, was making solid progress in both yield and device performance and was set to enter production in 2025 as scheduled.

According to TSMC, its 2nm technology will provide up to 15 percent speed improvement over N3E at the same power and up to 30 percent power reduction at the same speed, and chip density of over 15 percent greater than N3E.

Regarding its N3E range of products, TSMC said its 3nm technology was now in volume production, with an enhanced N3E version set to enter high-volume manufacturing in the second half of 2023.

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