TSMC Teams Up With EDA Companies to Speed Up Design Flows

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With the rollout of new processing tech, TSMC is now teaming up with a number of prominent EDA and verification companies to accelerate design flows.

www.allaboutcircuits.com/, May. 03, 2023 – 

TSMC is partnering with several well-established EDA companies, including Synopsys, Cadence, Ansys, and Keysight Technologies, to accelerate the design flow process for chips in applications from automotive to hyper-scale computing.

These collaborations are both tackling technical challenges across various applications while also giving TSMC an opportunity to advance the power, performance, and area (PPA) of its various process technologies from 3nm to 3DFabric.

N4AE and N3AE for Automotives

TSMC announced its intent to target the automotive industry at the 2023 North America Technology Symposium with the announcement of the N4AE and N3AE (4nm and 3nm auto-early, respectively) process nodes, which are variants of TSMC's 4nm and 3nm process nodes.

The company hopes to address a unique cross-section of challenges for automakers: the higher standard of reliability and safety for automotive chips and the resulting lag in chip technology due to the extra development time to meet these standards. This means that chips used in vehicles can be several generations behind cutting-edge.

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