Samsung Electronics to hoist foundry IP portfolio to narrow gap with TSMC

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Samsung Electronics Co. will join hands with intellectual property (IP) partners essential in chip design to expand its advanced IP portfolio and establish a foundry ecosystem, with hopes to narrow the gap with foundry leader Taiwan Semiconductor Manufacturing Co. (TSMC).

pulsenews.co.kr/, Jun. 14, 2023 – 

According to the company's semiconductor business newsroom on Wednesday, Samsung Electronics plans to unveil its collaboration details with IP partners such as Synopsys, Cadence, and AlphaWave, and also its cutting-edge IP roadmap strategy at Samsung Foundry Forum that will be held in San Jose, California, on June 28.

Semiconductor products are a collection of numerous intellectual properties (IPs) and since fabless semiconductor design companies cannot develop all the necessary IPs for product design, IP companies typically develop specific IPs and provide them to fabless companies, integrated device manufacturers (IDMs), and foundry firms, earning licensing fees for IP usage.

Through these collaborations, Samsung Electronics will share foundry process information necessary for the development of cutting-edge IPs, such as process design kits (PDKs) and design methodologies (DMs), with its IP partners.

In return, the IP partners will develop IPs optimized for Samsung Electronics' foundry process and offer them to domestic and international fabless customers.

Samsung Electronics plans to proactively secure core IPs needed by customers in various fields, including artificial intelligence (AI), graphics processing units (GPUs), high-performance computing (HPC), automotive, and mobile, thereby attracting new fabless customers and enhancing customer development support capabilities. The IP portfolio will include dozens of IPs that can be processed from 3-nanometer to 8-nanometer processes.

Samsung Electronics plans to collaborate with global IP partners to develop interface IPs that enable high-speed data input and output, such as PCIe 6.0, DDR5, LPDDR5X, and advanced package-related IPs like UCIe, which involves packaging multiple semiconductors into a single package.

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