GlobalFoundries and Microchip Announce Microchip's 28nm SuperFlash® Embedded Flash Memory Solution in Production

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Widely deployed non-volatile memory (NVM) solution is optimized for microcontrollers, smartcards, and IoT chips

gf.com/, Sept. 27, 2023 – 

CHANDLER, Ariz., and Malta, New York, September 27, 2023 – GlobalFoundries (GF) (Nasdaq: GFS) and Microchip Technology (Nasdaq: MCHP), via its Silicon Storage Technology (SST) subsidiary, today announces the immediate release to production of the SST ESF3 third-generation embedded SuperFlash non-volatile memory (NVM) solution in the GF 28SLPe foundry process.

GF has established a new industry benchmark for implementing SST's widely deployed ESF3 SuperFlash technology. This implementation delivers the following capabilities and benefits:

• Lowest cost 28nm HKMG ESF3 solution with only 10 masks added, incl. true 5V IO CMOS devices
• Highly competitive SST ESF3 bitcell size of only 0.04 micron squared
• Operating temperature rating of -40 degrees C to 125 degrees C
• Sub-25 nanosecond (ns) read access times, 10 microsecond program times and 4 millisecond erase times
• Endurance exceeding 100,000 program/erase cycles
• No impact to design flows using GF 28SLPe platform-qualified IP (EG flow)
• Immediate availability of off-the-shelf macros, from 4 megabits (Mb) to 32 Mb
• Access to custom macro design support from SST or GF

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