Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs

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Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets–an important for applications like AI and others.

www.allaboutcircuits.com/, Sept. 26, 2023 – 

As any engineer knows, ICs are much more than just silicon. The sundry components–such as the packaging, leads, and substrate–all factor into the durability and ultimate capability of the component. Increasingly, the substrate–the material the silicon IC wafer is mounted on–is playing a significant role in allowing for more computing power in one package.

Feeding those needs, Intel has announced a new glass-substrate technology for the next generation of high-power processors.

Glass as a substrate is not a new concept. For nearly a decade now, the very smallest of chips, wafer level chip scale (WLCS) components have used a glass substrate. In this form factor, the BGA (ball grid array) solder balls are mounted directly on the IC wafer, which is then mounted circuitry-side down in flip-chip style with a protective glass substrate on the topside.

Some of the more common chips to use this package system are power components such as voltage regulators and converters. The smallest of these parts are only a few millimeters square and yet can handle the same power as a large TO-220 form factor due to the more direct thermal path through the solder balls and the glass substrate as a heat spreader.

Glass as a substrate has many advantages over more conventional materials, both in the manufacturing phase and in the end application. Now, Intel is looking to bring those thermal properties and other improved substrate characteristics to its largest chips with a newly developed large glass substrate technology.

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