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Samsung to unveil 3D AI chip packaging tech SAINT to rival TSMC

The race for 3D chip packaging tech gets even fiercer as shrinking chips becomes increasingly challenging

www.kedglobal.com/, Nov. 12, 2023 – 

Samsung Electronics Co., the world's largest memory chipmaker, plans to unveil an advanced three-dimensional (3D) chip packaging technology next year to compete with foundry leader Taiwan Semiconductor Manufacturing Company (TSMC).

The Suwon, South Korea-based chipmaker will use the technology – SAINT, or Samsung Advanced Interconnection Technology – to integrate memory and processors required of high-performance chips, including AI chips, in much smaller sizes.

Under the SAINT brand, Samsung plans to unveil three types of technologies – SAINT S, which vertically stacks SRAM memory chips and the CPU; SAINT D, which involves vertical packaging of processors such as the CPU and GPU and DRAM memory; and SAINT L, which stacks application processors (APs), people familiar with the matter said on Sunday.

Current 2.5D packaging tech, in most cases, horizontally assembles different types of chips side by side.

Some of Samsung's new technologies, including SAINT S, have already passed validation tests. However, Samsung will launch its commercial services next year after further tests with clients, sources said.

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