Applied Materials and CEA-Leti Unveil Joint Lab For Rapidly Growing Specialty Chip Markets

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Based at CEA-Leti, Collaboration Focuses on Materials Engineering Solutions. To Accelerate Semiconductor Device Development for Applied's ICAPS Customers. Applied Materials 's Website

www.leti-cea.com/cea-tech/leti/english, Dec. 05, 2023 – 

Applied Materials, Inc. and CEA-Leti today announced an expansion of their longstanding collaboration to focus on developing differentiated materials engineering solutions for several specialty semiconductor applications.

The joint lab, which represents CEA-Leti's highest level of collaboration, aims to accelerate device innovations for Applied's customers serving ICAPS markets (IoT, Communications, Automotive, Power and Sensors). Technology applications in those fields include photonics, image sensors, RF communications components, power devices and heterogeneous integration.

Demand for ICAPS applications and devices is being driven by industrial automation, the Internet of Things (IoT), electric vehicles, green energy and smart grid infrastructure, among other major high growth markets. Projects at the joint lab will focus on developing solutions for a variety of materials engineering challenges to enable the next wave of ICAPS device innovation. The joint lab features several of Applied Materials' 200mm and 300mm wafer processing systems and leverages CEA-Leti's world-class capabilities for evaluating performance of new materials and device validation. Improvements in power consumption, performance and area/cost, along with faster time to market (PPACt™), will be key objectives of the joint team.

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