IP-SOC DAYS 2025 IP-SOC DAYS 2024 IP-SOC DAYS 2023 IP-SOC DAYS 2022 IP-SOC DAYS 2021 IP-SOC 2024 IP-SOC 2023 IP-SOC 2022 IP-SOC 2021
|
|||||||
![]() |
|

Arm CSA and AMBA release provide boost for chiplet ecosystem
- Arteris Expands Multi-Die Network-on-Chip Design IP and Software
- Synopsys Reinvents Semiconductor Design: AI-Driven EDA Tools Lead the Charge in Next-Gen Chip Innovation
- Siemens streamlines design and analysis�of complex, heterogeneously integrated 3D ICs
- Siemens turbocharges semiconductor and PCB design portfolio with generative and agentic AI
- Mirabilis Design Signs OEM Agreement with Cadence to Deliver VisualSim for System-Level Modeling and Performance Optimization
- Tenstorrent Acquires Blue Cheetah Analog Design (Jul. 02, 2025)
- Consumer-Tech Brand, Nothing, Taps Ceva's RealSpace Software to Bring Immersive Spatial Audio to Headphones and Earbuds (Jul. 02, 2025)
- Intel Reportedly Weighs Dropping 18A, Bets on 14A to Attract Clients and Challenge TSMC (Jul. 02, 2025)
- Arteris Expands Multi-Die Network-on-Chip Design IP and Software (Jul. 02, 2025)
- Three Pillars for Semiconductor Success in the Chiplet Economy (Jul. 02, 2025)
- See Latest News>>
Two new Arm initiatives could boost chiplets: an ecosystem around the Arm chiplet system architecture, and updated AMBA specification.
www.embedded.com/, Feb. 16, 2024 –
Chiplets are in vogue, with the big challenges on everyone's mind being how to put together chiplets from different providers and do it effectively. Well, the latest two initiatives from Arm could just be the kind of boost the chiplet movement could benefit from – one is the announcement of an ecosystem of partners developing the Arm chiplet system architecture (CSA), and the other is the updating of the AMBA specification for chiplets.
On the first initiative, Arm and a group of over 20 partners are analyzing and defining optimal partitioning choices for chiplet-based systems. The goal is to develop the Arm CSA, which will enable greater reuse of components (physical design IP, soft IP) between multiple suppliers. The group covers multiple market segments from mobile to automotive to infrastructure, exploring how they can better standardize around system design choices for different chiplet types, such as how to partition an Arm-based system across multiple chiplets, or their high-level properties (e.g. requirements for system memory or a root of trust).
The second initiative involves extending the AMBA specification to the chiplets market by formally releasing AMBA CHI C2C as an open specification, which will allow chiplets to be used across a wide variety of computing systems without the risk of fragmentation. AMBA CHI C2C specification leverages the existing on-chip CHI protocol and defines how it is packetized, enabling it to be transported chip(let)-to-chip(let).