Samsung Demonstrates New CXL Capabilities and Introduces New Memory Module for Scalable, Composable Disaggregated Infrastructure at Memcon 2024

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SAN JOSE, Calif.--(BUSINESS WIRE)--Today at Memcon 2024, Samsung Electronics, a world leader in advanced semiconductor technology, unveiled the expansion of its Compute Express Link (CXL) memory module portfolio and showcased its latest HBM3E technology, reinforcing leadership in high-performance and high-capacity solutions for AI applications.

www.businesswire.com/, Mar. 26, 2024 – 

In a keynote address to a packed crowd at Santa Clara's Computer History Museum, Jin-Hyeok Choi, Corporate Executive Vice President, Device Solutions Research America – Memory at Samsung Electronics, along with SangJoon Hwang, Corporate Executive Vice President, Head of DRAM Product and Technology at Samsung Electronics, took the stage to introduce new memory solutions and discuss how Samsung is leading HBM and CXL innovations in the AI era. Joining Samsung on stage was Paul Turner, Vice President, Product Team, VCF Division at VMware by Broadcom and Gunnar Hellekson, Vice President and General Manager at Red Hat to discuss how their software solutions combined with Samsung's hardware technology is pushing the boundaries of memory innovation.

"AI innovation cannot continue without memory technology innovation," said Choi. "As the market leader in memory, Samsung is proud to continue advancing innovation – from the industry's most advanced CMM-B technology, to powerful memory solutions like HBM3E for high-performance computing and demanding AI applications. We are committed to collaborating with our partners and serving our customers to unlock the full potential of the AI era together."

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