Synopsys SNUG: AI driven EDA momentum, new tools for multi-die

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Synopsys highlighted momentum its ai suite which includes DSO.ai and VSO.ai, and introduced 3DSO.ai to enable 3D design space optimization for multi-die systems, plus new hardware-assisted verification solutions and access to a new cloud hybrid system.

www.embedded.com/, Apr. 01, 2024 – 

At this year's Synopsys User Group (SNUG) conference in Santa Clara, California, Synopsys CEO both announced a number of new tools and initiatives as well as demonstration of traction of its AI-driven EDA tools.

The company highlighted the market momentum for its Synopsys.ai suite which includes the DSO.ai and VSO.ai tools, and introduced the 3DSO.ai tool to enable 3D design space optimization for emerging multi-die systems and architectural exploration with new two new hardware-assisted verification (HAV) solutions for faster, higher capacity emulation and prototyping. A new Cloud Hybrid solution was also announced, aimed at addressing a significant hurdle for mid-large semiconductor customers that have on-prem data centers but are sometimes limited by capacity.

In his keynote speech at the conference, Synopsys CEO Sassine Ghazi said, "The rapid advancement of AI, silicon proliferation, and software-defined systems are driving the era of pervasive intelligence, where technology is seamlessly integrated into our lives, bringing with it unprecedented opportunity and greater compute, energy, and design challenges for the technology industry."

Ghazi said Synopsys.ai has achieved hundreds of tape-outs to date and is delivering stunning customer results including a more than 10% boost in performance, power, area (PPA), up to 10X faster turn-around time and double-digit improvements in verification coverage, 4X faster test with the same coverage, and 4x faster analog circuit optimization when compared to optimization without the use of AI.

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