Faraday to Exhibit Next-gen ASIC Solutions at DAC 2024

Find the Latest SoC Solutions
for... Automotive... IoT... Security... Audio... Video

Jun. 18, 2024 – 

Hsinchu, Taiwan -- June 18, 2024 -- Faraday Technology Corporation, a leading ASIC design service and IP provider, will exhibit at the Design Automation Conference (DAC) on June 24-26, 2024, in San Francisco, CA, USA. Faraday will showcase its recent collaborations with Arm Automotive Ecosystem and Arm Total Design.

• The Arm automotive ecosystem will enable customers to leverage the latest Arm Automotive Enhanced (AE) technology and Cortex-A720AE IP to accelerate the development of AI-enabled vehicle ASICs with a focus on safety, efficiency, and quality.
• In its partnership with Arm Total Design, Faraday leverages its design proficiency and Arm’s Neoverse Compute Subsystems (CSS) to deliver SOCs with unparalleled performance and efficiency for cutting-edge cloud and high-performance computing (HPC).

Faraday will also discuss its engagement models for Design Implementation Services (DIS) and comprehensive 3DIC packaging integration tailored to diverse customer requirements. Faraday’s strong collaborative manufacturing network, including Intel Foundry, Samsung Foundry, and UMC, provides mature and leading-edge nodes to optimize performance, power, area (PPA), and costs.

"We are excited to showcase our advanced ASIC solutions at DAC," said K.H. Lee, President of Faraday USA. "Our expertise in Arm Neoverse CSS design, Arm Cortex-A720AE integration, and 3DIC packaging interposer design and implementation positions us well to support our customers' most innovative projects. We look forward to reconnecting with our partners at the event and helping more customers bring their product development plans to fruition."

Visit Faraday's booth at #2450 to explore Faraday’s latest ASIC and IP solutions.

About Faraday Technology Corporation

Faraday Technology Corporation (TWSE: 3035) is dedicated to the mission of benefiting humanity and upholding sustainable values in every IC it handles. The company offers a comprehensive range of ASIC solutions, including total 3DIC packaging, Neoverse CSS design, FPGA-Go-ASIC, and design implementation services. Furthermore, its extensive silicon IP portfolio encompasses a wide array of offerings, such as I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, LPDDR4/4X, DDR4/3, MIPI D-PHY, V-by-One, USB 3.1/2.0, 10/100 Ethernet, Giga Ethernet, SATA3/2, PCIe Gen4/3, and SerDes. For further information, visit www.faraday-tech.com .

 Back