Advanced Packaging Drives New Memory Solutions for the AI Era

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Lam Research's advanced packaging breakthroughs enable fast, high-bandwidth memory for ​the ​AI-everywhere world

eetimes.com, Sept. 19, 2024 – 

From self-driving cars to advanced data analysis, the continuing growth of artificial intelligence (AI) applications has significantly changed the demands for computing power and memory. AI technologies require extensive computational capabilities and rapid data processing. This puts increasing pressure on the underlying hardware to deliver improved performance.

Innovative solutions in memory and processing architecture are needed – most notably, high-bandwidth memory (HBM) enabled by advanced packaging.

Traditional chip design limitations highlight ​the ​importance of advanced packaging

Historically, chip design advancements have followed Moore's Law, which predicted that the number of transistors on a microchip would double approximately every two years, leading to improved performance. However, this trend is facing physical and technical limitations.

​​Conventional chip designs must be revamped to meet ​AI's​​ ​high-speed data transfer and low-latency demands. These limitations drive the semiconductor industry to explore advanced packaging solutions that can integrate multiple chips into a single package, enhancing performance and efficiency while extending Moore's Law.

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