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Rambus Unveils Industry-First Complete Chipsets for Next-Generation DDR5 MRDIMMs and RDIMMs to Deliver Breakthrough Performance for Data Center and AI

www.rambus.com, Oct. 15, 2024 – 

Highlights:

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Figure 1: DDR5 MRDIMM 12800 (Front) Concept Image Showing Rambus MRCD, MDB, SPD Hub and Temperature Sensor ICs

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Figure 2: DDR5 MRDIMM 12800 (Back) Concept Image Showing Rambus PMIC5030 and MDB ICs

SAN JOSE, Calif. – Oct. 15, 2024 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today unveiled industry-first, complete memory interface chipsets for Gen5 DDR5 RDIMMs and next-generation DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMMs). These innovative new products for RDIMMs and MRDIMMs will seamlessly extend DDR5 performance with unparalleled bandwidth and memory capacity for compute-intensive data center and AI workloads.

The new Rambus chips include:

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