CEA-Leti to Present Breakthroughs in Memory, RF, FDSOI at IEDM

electronicsbuzz.in, Nov. 08, 2024 – 

CEA-Leti will highlight its most recent research advances in several fields at the 2024 International Electron Devices Meeting (IEDM), Dec. 7-11, at the Hilton San Francisco Union Square. Presentations include three R&D firsts:

• ferro-based memory scaling integrated into the back-end-of-line (BEOL) at the 22nm FDSOI technology node

• an integrated phase modulator and sensor (IPMS) offering improved scalability, compactness, and intrinsic optical alignment for digital optical phase conjugation (DOPC) applications, and

• the first adaptation of the forward-forward algorithm for resistive memory.

"CEA-Leti, together with its academic and industrial partners, will present cutting-edge results in the fields of low-power components, quantum technologies, RF, heterogeneous integration, emerging memories, and new computing paradigms," said Thomas Ernst, scientific director, CEA-Leti.

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