MZ Technologies Unveils Next Generation Chiplet/Package Design Tool

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Jan. 14, 2025 – 

ROME, Jan. 14, 2025  -- MZ Technologies, a leading supplier of innovative solutions and methodologies for 2.5 and 3D design, today unveiled GENIO EVO, the first integrated chiplet/package EDA tool to address in pre-layout stage the two major issues of 3D-IC design, thermal and mechanical stress. MZ will demonstrate this new tool at the Chiplet Summit, being held from January 21-23, 2025 at the Santa Clara Convention Center.

GENIO EVO is the second generation of GENIO^™, which was the EDA's first successful integrated chiplet/package co-design tool. GENIO, MZ's flagship product, is a cross-fabric platform for system design providing chiplet/die, silicon interposer, package, and surrounding PCB co-design features that achieve area, power, and performance targets. The tool is technology agnostic and seamlessly integrates through standard formats with all the existing commercial implementation platforms or to custom EDA flows through dedicated plug-ins.

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