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Rapidus aims to deploy 10 EUV machines for 2nm chip production in Japan

Japan's semiconductor ambitions take a significant leap as Rapidus plans to deploy 10 advanced EUV lithography systems. The chipmaker aims to begin 2nm chip trial production by April 2025, challenging established players like TSMC and Samsung in the cutting-edge semiconductor manufacturing space.

notebookcheck.net, Jan. 31, 2025 – 

Rapidus, a Japanese chipmaker, is planning to roll out 10 cutting-edge extreme ultraviolet (EUV) lithography systems across its new production sites–a move that's expected to give Japan's advanced chip manufacturing a notable boost. CEO Atsuyoshi Koike shared these plans for the upcoming IIM-1 and IIM-2 plants, as reported by Nikkan Kogyo Shimbun.

Things picked up in December 2024 when the very first EUV lithography machine arrived at New Chitose Airport–the first ever in Japan. According to the company's timeline, Rapidus wants to kick off 2nm trial production at IIM-1 as early as April 2025, with the goal of sending sample chips to U.S.-based semiconductor giant Broadcom by June.

Looking at production capacity, estimates suggest that if five EUV tools run at maximum capacity, IIM-1 could process somewhere between 17,000 and 20,000 wafers each month–assuming around 20 EUV layers in the fabrication process. Rapidus will be using ASML's Twinscan NXE:3800E scanner, which can theoretically push through up to 220 wafers per hour at a 30mj/cm² dose.

With an ambitious mass production target for 2nm chips set for 2027, Rapidus is stepping onto a playing field crowded with established heavyweights. TSMC, for example, plans to start producing 2nm chips in 2025 and already has major clients like Apple, Nvidia, AMD, and Qualcomm lined up.

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