Predictions for Multi-Die System Designs in 2025

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eejournal.com, Feb. 04, 2025 – 

There's a famous saying along the lines of, "Predicting things is difficult, especially about the future." This quote has been attributed to many people, including Mark Twain, Niels Bohr, and Yogi Berra. In Yogi's case, however, it's usually phrased as, "It's tough to make predictions, especially about the future."

I know that when I staggered into the current millennium, buoyed by the Y2K celebrations, I would never have predicted the current surge into multi-die system space (where no one can hear you scream).

Let's briefly set the scene to ensure we're all tap-dancing to the same skirl of the bagpipes. According to an article by Brian Santo on EETimes, the term "chiplet" can be found in patents as early as 1969. However, this referred to column driver chiplets attached to large LCD panels. The use of "chiplet" in the context we understand today was coined by University of California, Berkeley professor John Wawrzynek in 2006 (OMG, that's almost 20 years ago as I pen these words).

As recently as five years ago, in 2020, the topic of chiplets wasn't heard often in mainstream usage. Now, by comparison, one cannot help but hear people talk about it (the trick is to get them to stop talking about it).

Chiplets mean different things to different people. In my earlier Are You Ready for the Chiplet Age? column from 2023, I noted that Synopsys had identified four main chiplet use cases...

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