Intel set to begin 18A tape-outs later this year, according to reports

Media reports suggest that Intel's launch of a website for its 18A (1.8nm) process, highlights its readiness for third-party customers and planned tape-outs in the first half of 2025.

newelectronics.co.uk, Feb. 24, 2025 – 

Media outlet, Liberty Times, suggests that this puts Intel slightly ahead of TSMC and, notably, Intel's Principal Engineering Program Manager, Joseph Bonetti, has claimed that Intel 18A, set for Panther Lake processors, is nearing completion.

Bonetti also reportedly stated that Intel Foundry is set to prove itself with its own products, followed by early 18A adopters Microsoft and Amazon.

According to Intel, the 18A will be the 'earliest available' sub-2nm advanced node manufactured in North America, providing a reliable supply option for customers at a time of rising trade tensions and the threat of President Trump imposing higher chip tariffs.

TSMC has begun mass production at its first Arizona fab with 4nm. However, it may wait until its third Arizona fab, expected by the end of 2030, to adopt 2nm or more advanced nodes, according to the company's website.

According to Liberty Times, one of the key innovations with 18A is backside power delivery using PowerVia, which improves density and cell utilisation by 5 to 10 percent and reduces resistive power delivery droop, resulting in up to 4 percent.

Another major advancement is RibbonFET, Intel's take on gate-all-around (GAA) transistors. This design allows finer current control and reduces leakage, which is critical as chips become smaller and more densely packed.

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