Pragmatic launches platform for mixed-signal flexible ASIC design

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Enriched process design kit, compatible with standard EDA tools.

engineering.com, Mar. 06, 2025 – 

Pragmatic Semiconductor Ltd. announced the launch of Pragmatic FlexIC Platform Gen 3, offering a 10x digital power and 3x digital area improvement over the previous generation.

The platform comprises a process design kit (PDK) – compatible with standard electronic design automation (EDA) tools – and standard cell libraries, enabling innovators to swiftly design and manufacture custom FlexICs – the company’s ultra-thin, physically flexible application-specific integrated circuits (ASICs) with a low carbon footprint. An active early-access program is enabling lead customers to design on the platform, driving exciting FlexIC innovation that will transform industries and applications.

A more accessible and cost-efficient alternative to traditional semiconductor platforms, FlexIC Platform Gen 3 enables customers to create highly customized, more sustainable designs, leveraging the unique form factor – along with rapid fabrication capabilities and enhanced design efficiency – to bring innovative products to market faster than ever before.

The platform provides manufacturing capabilities via the Pragmatic FlexIC Foundry – the UK’s first 300mm fabrication site (fab), housed at the company’s flagship production facility, Pragmatic Park, Co. Durham, England, with capacity to produce billions of chips per year. The foundry’s innovative and highly efficient production process significantly reduces the carbon footprint of semiconductor fabrication. It also boasts cycle times of just days, taking designs from tape-out to delivery in weeks, for agile product development and faster go-to-market times.

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