- Synopsys ramps up collaboration with Taiwan's TSMC on A16 process
- SMIC Q2 revenues to take 6% hit due to tool maintenance and validation issues
- EDA Companies Throw Support Behind TSMC's New A14 Process
- Rapidus Starts Path to Advanced Chipmaking in Japan Government-backed startup's 2-nanometer pilot production gets underway
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
IP-SOC DAYS 2025 IP-SOC DAYS 2024 IP-SOC DAYS 2023 IP-SOC DAYS 2022 IP-SOC DAYS 2021 IP-SOC 2024 IP-SOC 2023 IP-SOC 2022 IP-SOC 2021
|
|||||||
![]() |
|

X-FAB, SMART Photonics, and Epiphany Design Collaborate on Advanced Heterogeneous Photonics Integration Platform
- Perforce Partners with Siemens for Software-Defined, AI-Powered, Silicon-Enabled Design (May. 16, 2025)
- Semidynamics: From RISC-V with AI to AI with RISC-V (May. 16, 2025)
- TSMC Board of Directors Meeting Resolutions (May. 16, 2025)
- Arm Evolves Compute Platform Naming for the AI Era (May. 16, 2025)
- Secafy Licenses Menta's eFPGA IP to Power Chiplet-Based Secure Semiconductor Designs (May. 15, 2025)
- See Latest News>>
embedded.com, Mar. 26, 2025 –
X-FAB Silicon Foundries SE, a leading analog/mixed-signal and specialty foundry, SMART Photonics, a premier Indium Phosphide (InP) integrated photonics foundry, and Epiphany Design, a fabless photonic design house specializing in hybrid and heterogeneous photonics, have joined forces to develop a cutting-edge heterogeneous photonics integration platform. This platform leverages the combined strengths of InP and Silicon-on-Insulator (SOI) technologies to enable multi-terabit data rates for data communication and telecommunications applications.
By co-optimizing SOI, InP, and Micro-Transfer-Printing (MTP) technologies, the new platform is designed to meet customer demands for high-speed data transmission and energy efficiency in high-volume optical transceiver manufacturing. In addition to enhancing system performance and introducing new functionalities, it lowers integration costs by relaxing photonics packaging requirements. MTP technology, originally pioneered by X-Celeprint, offers system and product designers greater flexibility by enabling the seamless integration of chiplets into product architectures.
Significant progress has already been made within this collaboration, culminating in the development of a design flow and process design kit (PDK) that facilitates the integration of InP chiplets onto an SOI-based photonic circuit. This design flow is fully implemented in Luceda’s IPKISS EDA tool, with Luceda’s technical expertise playing a key role in supporting the development of the demonstrator.
As a major milestone in this initiative, Epiphany Design—an X-FAB innovation partner and part of the XCHAIN ecosystem—has successfully demonstrated the heterogeneous InP-on-SOI design flow through an optical transceiver demonstrator. The results of this collaboration will be presented at the 50th Optical Fiber Communication Conference (OFC) in San Francisco next week.