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TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
Aug. 18, 2025, Aug. 18, 2025 –
TSMC is shedding legacy fabs and moving to larger wafers.
By Majeed Ahmad, EETimes (August 13, 2025)
After shaking the gallium nitride (GaN) power electronics world by announcing its intention to quit wafer fabrication, TSMC has thrown another stunner—Taiwan’s mega-fab plans to phase out its 6-inch wafer manufacturing over the next two years. This came to light after the company issued a statement of clarification to a news outlet in relation to its plans on the facility.
Following this decision, TSMC has already notified customers that its Fab 2, which produces 6-inch wafers, will cease production in 2027. The company will later provide final wafer schedules and plans to assist them with transfers to other fabs. Currently, TSMC has one 6-inch wafer fab, four 8-inch wafer fabs, and four 12-inch fabs in Taiwan.
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