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TSMC, Samsung Reportedly Cut 8-Inch Wafer Output, Boosting Korea’s DB HiTek
Nov. 17, 2025 –
Samsung and TSMC are reportedly scaling back their 200mm (8-inch) foundry operations in response to shifting industry dynamics. According to South Korean outlet Hankyung, the two chipmakers have recently begun focusing more on advanced manufacturing using 300mm (12-inch) wafers to produce high value-added processors such as GPUs.
The report, citing industry sources, states that TSMC plans to cut about 30% of its 200mm production lines over the long term, while Samsung has already scaled its 200mm capacity down to roughly half of its peak and is considering additional reductions. Still, both companies continue to serve clients dependent on 200mm foundry lines and are not planning a complete exit from the segment.
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