Addressing the Biggest Bottleneck in the AI Semiconductor Ecosystem

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Dec. 18, 2025 – 

By Maksym Plakhotnyuk, CEO and Founder, ATLANT 3D
EETimes

By In March, TSMC announced plans to invest $100 billion in U.S.-based semiconductor manufacturing facilities (the largest single foreign investment in U.S. history) including the opening of a new advanced packaging facility.

This is great news for the U.S. as it would bring the country one step closer to a fully independent, end-to-end semiconductor manufacturing supply chain. To date, U.S.-manufactured chips still have to be sent back to Taiwan for packaging. This not only creates extra cost (that new tariffs may make even heavier), but introduces a potential point of risk as the U.S. chip supply chain has not entirely achieved a state of self-reliance.

Increasingly, advanced packaging is emerging as a key technology that will likely determine the global winners in the AI race. 

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