Chiplets: 8 best practices for engineering multi-die designs

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Mar. 26, 2026 –

By Rob Kruger, Synopsys
EDN

Semiconductor design is in the midst of a structural shift. For decades, performance gains were achieved by packing more transistors into single, monolithic dies. But the physical limitations of these dies—and the process technologies used to create them—are at odds with the ever-increasing compute, memory, and I/O demands of modern workloads. In other words, process technology advances alone are not enough to keep up with modern workloads.

Stepping in to address these demands are multi-die designs, which combine several smaller dies (known as chiplets) inside a single standard or advanced package. These multi-die architectures are reshaping how engineers build everything from AI accelerators to automotive ADAS systems. By disaggregating compute, memory, and I/O, teams can mix and match chiplets—often from different process nodes—to optimize performance, energy efficiency, size, or cost.

However, multi-die designs introduce new engineering complexities and design considerations, spanning packaging, verification, thermal dynamics, and more.

Here are eight best practices for developing chiplet designs.

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