Find Top SoC Solutions
for AI, Automotive, IoT, Security, Audio & Video...

TES unveils a next-generation Elliptic Curve Digital Signature Algorithm (ECDSA) IP Core for Secure IoT, Blockchain, and Industrial Systems

Mar. 26, 2026 –

TES Electronic Solutions GmbH unveils a next-generation VHDL-based ECDSA (Elliptic Curve Digital Signature Algorithm) IP core, designed to deliver high-performance, secure, and energy-efficient cryptographic processing for modern embedded systems. The IP is designed for elliptic curve cryptography (ECC) using the ANSI X9.63 secp256k1 Koblitz curve and can be integrated into a wide range of applications and target technologies.

Key Benefits

For more information on this and other digital IP solutions, visit the TES IP products page.

Contact

For inquiries, please email info@tes-dst.com

About TES

With over 20 years of experience in ASIC design and embedded graphics IP, TES is a one-stop partner for high-performance semiconductor solutions. Our IP portfolio includes highly customizable 2D, 2.5D, and 3D GPUsdisplay controllers, and a wide range of analog and digital IP blocks, ranging from SiGe RF to industrial ASIC solutions.

Headquartered near Stuttgart, Germany, TES Electronic Solutions GmbH serves a global customer base, with design operations in Stuttgart and graphics IP development in Hamburg. Learn more at www.tes-dst.com.

 Back

Partner with us

List your Products

Suppliers, list and add your products for free.

More about D&R Privacy Policy

© 2024 Design And Reuse

All Rights Reserved.

No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse.