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Enabling the Chiplet Era: T2M Brings Production-Proven, UCIe-Ready Die-to-Die IP for Chiplet SOCs.

Apr. 27, 2026 –

 

T2M, today announced the commercial availability of its partner’s production-proven die-to-die interface IP core, aligned with the emerging UCIe ecosystem. This solution is already validated in mass production and is now accessible to a broader set of customers through T2M. It enables high-performance, low-latency connectivity across multi-die systems and next-generation chiplet-based architectures. This IP core is built on a robust AIB 2.0-based architecture offering customers a low-risk, deployment-ready path to chiplet integration.

Key Highlights

Target Applications

Flexible Licensing Model

The IP core is offered through T2M under a WhiteBox licensing model, providing:

This approach enables semiconductor companies to accelerate development while maintaining full control over integration and optimization.

Availability: This Die-Die IP Core is available for immediate licensing. For more information on licensing options and pricing, please drop a request / MailTo

About T2M: T2M is a global independent semiconductor technology expert, supplying complex semiconductor IP Cores, Software, KGD, and disruptive technologies enabling accelerated development of your Wearables, IOT, Communications, Storage, Servers, Networking, TV, STB, and Satellite SoCs.

 

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