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Semifive Wins 3D IC Turnkey Design Deal for Edge AI Chip
Apr. 30, 2026 –
European Vision AI Client Taps 8nm Ultra-Edge SoC Integrating Sensing and Inference
Semifive said on April 28 it has secured a turnkey design contract for an edge-focused 3D integrated circuit from a Europe-based vision AI company. The value of the deal was not disclosed.
Semifive will develop an ultra-edge system-on-chip based on an 8-nanometer process, covering the full scope from design through mass production. The chip is designed to integrate image sensing and AI inference within a single device, maximizing both performance and power efficiency.
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