SkyeChip Berhad: Malaysia’s Leading IC Design & Silicon IP Company – Business Overview, Competitive Strengths & Future Plans

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May. 04, 2026 –

SkyeChip Berhad is launching its IPO at a pivotal moment for the semiconductor and silicon IP design sector, offering investors direct access to a high-growth, innovation-driven business with deep exposure to China, Taiwan, and the broader APAC region.

• IPO Symbol: Not stated
• Offer Price / Range: Not stated
• Total Offer Size: Not stated
• Shares Offered: Post-IPO outstanding shares: 1,796,000,000 (enlarged to 1,857,755,000 assuming full exercise of ESOS Options)
• Dividend Policy: Not stated
• Placement / Issuance Breakdown: Not detailed in full, but includes allocations for public, institutional, anchor, and ESOS/Pink Form allocations to directors/employees.

Use of Proceeds: The IPO proceeds are aimed overwhelmingly at growth-driven initiatives, including silicon IP expansion, compute and AI silicon products, advanced packaging (2.5D/3D), and operational scaling. Key allocations are:

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