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AI demand reshapes semiconductor capacity and intensifies supply chain competition
May. 07, 2026 –
New research conducted by TrendForce suggests that the acceleration of artificial intelligence workloads since 2023 is placing growing pressure on some of the most advanced segments of the semiconductor industry, particularly at the cutting edge of process technology and packaging.
As demand for high-performance AI chips rises, competition for 3nm and below fabrication capacity, along with advanced packaging technologies such as 2.5D and 3D integration, is becoming increasingly intense.
One of the most persistent bottlenecks has been in advanced packaging, especially chip-on-wafer-on-substrate (CoWoS) technology. Shortages have extended beyond fabrication itself, affecting upstream equipment and downstream supply chains, including substrates, printed circuit boards, and high-bandwidth memory. This reflects how tightly interlinked the semiconductor ecosystem has become, with constraints in one area quickly cascading across multiple layers of production.
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