Malaysia launches advanced semiconductor packaging push to climb global value chain

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May. 11, 2026 –

New national consortium aims to build domestic high-end chip packaging capability within two years

Malaysia has launched an ambitious national initiative to develop domestic capability in advanced semiconductor packaging within the next two years, marking a strategic move to move further up the global chip value chain, as reported by BERNAMA, a partner of TV BRICS.

The initiative is being driven through the establishment of the Malaysia Advanced Packaging Consortium (MAPC), a coordinated national framework bringing together government support and industry expertise under a “whole-of-nation” approach to strengthen the country’s high-tech manufacturing ecosystem.

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