Find Top SoC Solutions
for AI, Automotive, IoT, Security, Audio & Video...

Samsung May Launch Physical AI Chiplet Platform Next Year

May. 28, 2026 –

By Binay Konwar, SammyGuru

 

Samsung may launch a Physical AI chiplet platform next year in collaboration with Cadence. The platform could support applications like robotics, autonomous driving, and industrial automation. It is being developed using the Korean foundry’s SF5A (5nm) process technology.

Samsung and Cadence develop 5nm chiplet platform for Physical AI

In January 2026, Samsung and Cadence announced a partnership to develop a chiplet-based Physical AI semiconductor platform. Until now, the Korean firm has mainly produced and supplied custom single-chip solutions for individual fabless customers. However, the new platform can transform a range of semiconductor chips for Physical AI.

Click here to read more ...

 

 

 Back

Partner with us

List your Products

Suppliers, list and add your products for free.

More about D&R Privacy Policy

© 2024 Design And Reuse

All Rights Reserved.

No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse.