SemiFive Showcases 3D-IC Technology at Samsung SAFE Forum

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Jun. 01, 2026 –

Company highlights memory bottleneck solution for AI systems

By Lee Jun, TheElec.net

Brandon Cho, chief executive officer of SemiFive, presented the company's "Advanced 3D-IC and Big Die Solutions for AI Innovation" at Samsung Electronics' SAFE Forum 2026 held on May 28 in the US.

Application-specific integrated circuit (ASIC) design based on 3D-IC technology vertically connects stacked memory directly to computing chips. The shortened physical distance between processors and memory enables faster data transfer speeds. The approach is aimed at addressing memory bottlenecks that have emerged as a major constraint in the advancement of AI performance.

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