Imagination Technologies Brings GPU Expertise to CHASSIS’ New Chiplet Project

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Jun. 18, 2026 –

Imagination contributes  its latest functionally safe GPU IP to the CHASSIS program's new Automotive Base Die.

Imagination Technologies (“Imagination”) today announces its contribution to the European CHASSIS program’s new Automotive Base Die. This 5nm chiplet project is laying the foundation for the open and standardised chiplet ecosystem that is crucial for the next generation of software-defined vehicles.  

Specifically, Imagination has contributed its latest functionally safe product for automotive graphics and compute: the Imagination DXS GPU IP.  This chiplet-ready ASIL-B certified solution extends the capabilities of the Automotive Base Die into next-generation, graphics-rich in-vehicle infotainment and cockpit workloads; it also offers a flexible co-processor option for AI-related tasks.  

“Chiplets are reshaping automotive compute,” says Markus Mosen, Chief Executive Officer, Imagination Technologies. “By contributing to the Automotive Base Die, Imagination is ensuring that the open chiplet ecosystem can deliver the responsive displays and in-vehicle entertainment that OEMs want in their next generation of cars.”  

The Automotive Base Die acts as the central communication and integration hub for automotive System-on-Chip (SoC) infrastructure, designed to enable seamless integration of third-party chiplets via the Universal Chiplet Interconnect Express (UCIe) standard. This initiative, funded within the Chips-JU program CHASSIS by leading European entities BMW, imec, and Bosch, aims to foster unprecedented flexibility and innovation in the automotive industry.  

The CHASSIS program, coordinated by Bosch, is a three-year European research project focused on creating an open chiplet ecosystem for secure and scalable technology in software-defined mobility. The Automotive Base Die represents a significant step towards CHASSIS’s goal of establishing a standardized, open chiplet-based platform that will drive competition and foster innovation across the industry.  

By enabling early interoperability testing with other chiplets and accelerating European-centric design, the Automotive Base Die is poised to strengthen Europe’s position in advanced semiconductor design and manufacturing, while fostering a more agile and innovative automotive supply chain.  

CHASSIS receives funding within the Chips Joint Undertaking (Chips JU) and National Authorities under grant agreement 101252788.

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