Wireless SoC Development Accelerated with T2M’s Silicon-Proven RF IP Core Portfolio

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Jul. 02, 2026 –

T2M continues to expand its silicon-proven Wireless Connectivity RF IP portfolio, spanning Bluetooth®, Wi-Fi, UWB, and NFC technologies across leading foundries and process nodes. As demand grows for intelligent, connected devices, semiconductor companies are challenged to integrate advanced connectivity, precise positioning, secure access, and ultra-low-power operation while meeting aggressive time-to-market targets for increasingly complex SoCs. Our production-proven wireless RF IP cores help customers reduce design risk, shorten development cycles, accelerate product deployment, and develop differentiated solutions for consumer, industrial, automotive, and emerging AI-driven markets.

The rapid adoption of AI-powered wearables, asset tracking platforms, smart home devices, industrial IoT systems, digital key solutions, and connected vehicles is driving demand for next-generation wireless technologies. Bluetooth® Channel Sounding and UWB enable accurate ranging and location awareness, while Wi-Fi 6/7 delivers high-bandwidth connectivity for data-intensive edge applications. Zigbee, Thread, and Matter are accelerating the adoption of interoperable smart home and IoT ecosystems, enabling seamless device connectivity across multiple vendors and platforms. NFC complements these technologies by enabling secure authentication, device pairing, and contactless access, helping create seamless and secure user experiences across modern connected ecosystems.

T2M's wireless IP portfolio enables customers to leverage proven RF architectures while focusing engineering resources on product differentiation and faster market adoption.

Key Benefits

• Silicon-proven IP cores to reduce development and tape-out risk
• Accelerated SoC development and faster time-to-market
• Optimised power, performance, and area (PPA)
• Leverage proven architectures across multiple SoC generations
• Support across leading foundries and process nodes
• Scalable solutions for AI, consumer, industrial, and automotive markets

T2M will be attending DAC 2026 from 26–29 July, Long Beach, CA.

Meet with T2M's leadership team to discuss how our silicon-proven wireless RF IP cores can accelerate your next-generation SoC development.

About T2M

T2M provides a broad portfolio of semiconductor IP solutions, including Cellular & Satcom IPs (GNSS, SDR, NTN, LTE, 5G), RISC-V Processor IPs, Interface IPs (USB, PCIe, DDR, MIPI, HDMI), programmable SerDes, and ASIC design services. For more information on licensing options and pricing, please drop a request: contact@t-2-m.com  

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