Cadence Develops Agentic AI Platform for PCB Design

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Aug. 10, 2026 –

The AuraStack AI super agent coordinates advanced PCB and package design with simulation and sign-off but leaves application-specific tradeoffs to engineers.

By Abhishek Jadhav, embedded.com

Cadence Design Systems Inc. has extended its agentic AI offering with the launch of the AuraStack AI super agent, claiming the industry’s first agentic AI platform for printed circuit board (PCB) and advanced packaging design. AuraStack, powered by Nvidia Blackwell and Nvidia CUDA-X, coordinates PCB and advanced package workflows across system planning, component and library creation, physical implementation, multiphysics analysis, and manufacturing preparation.

The company is connecting its existing placement, routing, circuit simulation, and sign-off tools into a continuous workflow that can interpret an engineering objective, plan the required operations, and call the appropriate engines.

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