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Samsung Delays High-NA EUV Adoption Until 2030 for 1 nm Node
Aug. 13, 2026 –
Samsung Foundry has been consistently upgrading its chip-making tools. However, despite the availability of the new generation of EUV lithography, the company has not yet committed to using High-NA EUV lithography tools from ASML. According to ZDNet Korea, this is expected to change with the development of Samsung's 1 nm node, scheduled for 2030. This will be one of the last introductions of High-NA EUV machinery across leading-edge semiconductor node designs. Intel is gradually scaling up its 14A node to risk production with High-NA EUV tools, while TSMC is expected to introduce it in 2029. Samsung being one of the last does not necessarily mean the company is in a rush, as it is currently performing well with the existing Low-NA EUV tools.
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