Samsung Targets Memory Limits With 3D-Stacked HBM

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Sept. 03, 2026 –

Company maps out HBM5, zHBM and zNAND-O to boost capacity, bandwidth and power efficiency

By Selye Moon, thelec.net

Samsung Electronics unveiled a strategy to overcome memory technology limits in the artificial intelligence (AI) era. At its core is an architecture that vertically stacks memory and computing devices to sharply increase capacity within the same footprint while shortening data-transfer distances. The company is developing its proprietary zHBM and zNAND-O technologies following HBM5.

Choi Jang-seok, executive vice president and head of product planning for Samsung Electronics' Memory Business, presented the company's "CUBE" strategy during a keynote at the Memory Executive Summit at SEMICON Taiwan 2026 in Taipei on Sept. 1. CUBE stands for Capacity, Utilization, Bandwidth and Efficiency.

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