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Taiwan breaks ground on Kaohsiung advanced-packaging park anchored by TSMC
Sept. 24, 2026 –
Taiwan has begun construction of a new industrial park in Kaohsiung that will devote part of its footprint to advanced semiconductor packaging equipment and suppliers, as the island expands capacity around technologies increasingly important to artificial intelligence and high-performance computing.
The Kaohsiung City Government said the Baipu Industrial Park covers 88.73 hectares, including about 53 hectares of industrial land. Around 25 hectares are being positioned for advanced back-end semiconductor equipment and related supply-chain companies.
Reuters reported that Taiwan Semiconductor Manufacturing Co. plans two facilities at the site: a technology-validation laboratory and a talent-training center. The facilities are expected to begin operations in the fourth quarter of 2029.
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