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2.5D/3D Integration Challenges: Bare Die Testing
Oct. 05, 2026 –
By Nathaniel Peachey, incompliancemag.com
The semiconductor industry’s relentless pursuit of higher performance, smaller footprints, and greater functional density has brought 2.5D/3D heterogeneous integration firmly into the mainstream of IC manufacturing. However, along with these advancements, there are significant hurdles to be overcome, not the least of which is electrostatic discharge (ESD) challenges. Chiplets need to be evaluated for ESD robustness prior to being assembled into a 2.5D or 3D module to verify that they can survive even the low-level ESD voltages inherent in the 2.5D/3D integration process. However, particularly for the finer geometry chiplets, the industry’s existing qualification testing techniques are simply not able to measure their withstand capabilities.
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