D&R News Alert
www.design-reuse-embedded.com
www.design-reuse.com
www.design-reuse-china.com
June 30th, 2022
In this issue
• ARM launches ray tracing GPU core for smartphone chips
• Vidatronic Announces Power Management IP Now Certified on Globalfoundries' 22FDX® Platform for IoT Applications
• Synopsys and Arm Strengthen Partnership to Advance Next-Gen Mobile SoCs for Arm's Total Compute Solutions
• Cadence and Intel Foundry Services Collaborate to Accelerate Innovation with Scalable and Proven Cadence Cloud Solutions
$var->USER_FIRSTNAME

Welcome to the issue of June 30th, 2022 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Our partners at the Design Automation Conference (DAC) 2022
July 10-14, Moscone Center West, San Francisco, CA
Proteantecs
Menta
Openedges
Booth #2435
Booth #1346
Booth #2438
TrueChip
Agnisys
Flex Logix
Booth #1342
Booth #2512
Booth #1327

Foundry News
Foundry Ecosystem
PCIe™ 6.0 & CXL™ 3.0 Verification IP Solutions
Avery Design Systems
• PCIe 6.0: Root Complex, Endpoint, Retimer, PHY
• CXL 2.0/3.0: Type 1/2/3 Devices, Switch, Retimer
• Supports PCIe and CXL IDE/SPDM
• Compliance testsuites and services
• SV/UVM VIP and QEMU virtual platform co-sim

Memory IP
Design Platform
WAVE677DV / WAVE637DV for AV1 Multi-standards Video HW IP
Chips'n media • WAVE677DV/WAVE637DV for 8K/4K real-time video coding
• Support AV1, HEVC/H.265, AVC/H.264, and VP9 (decoder only)
• Low power and competitive IP size
 Learn more about WAVE677DV or WAVE637DV

Verification IP
Video and Image
Flex Logix’s EFLX® 4K eFPGA: The "Other" Compute Resource

Flex Logix • Add a flexible compute source to your SOC
• Provides more efficient parallel processing than CPU
• The best LUTs/sqmm with XFLX™ patented interconnect
• EFLX eFPGAs are great for signal processing

Full article | Learn more >>

Internet of Things
Automotive
True Circuits DDR PHYs Available Now!
True Circuits • Delivered as hard macro with I/Os to exact customer floorplan
• Easy to close timing, integrate and test
• Available in variety of protocols and TSMC processes

PHY Datasheet >>     TCI Homepage >>

RISC-V
Partner Busines News
Business News





Highlight from
Embedded World 22

Interview with Ralph Grundler, Sr Director Technical Marketing, Flex Logix Technologies, Inc.

Interview with Yoan Dupret, CEO, Menta

Interview with Geert-Jan Schrijen, CTO, Intrinsic ID

What they said at
IP SoC Silicon Valley 22

Interview with Mick Posner, Director of Marketing, Synopsys, Inc.

Interview with Gordon Allan, Product Manager, Questa Verification IP, Siemens EDA

Silicon IP is Key to the Future of Chips
Neeraj Paliwal, General Manager of Security IP, Rambus, Inc.

Interview with Amol Borkar, Director of Product Management and Marketing Tensilica Vision & AI DSPs, Cadence Design Systems, Inc.

Interview with Mick Posner, Director of Marketing, Synopsys, Inc.

Interview with Robert Rand, Solution Architect, Siemens - Tessent Embedded Analytics

REGISTER:
If this newsletter was forwarded to you by a colleague, you can have it sent directly to you at no cost. To register for D&R SoC News Alert, go to: https://www.design-reuse.com/users/signup.php

UPDATE YOUR PROFILE / UNSUBSCRIBE :
You are subscribed as $var->USER_MAIL and you receive this Alert in html format.

* If you wish to unsubscribe, you can do it there:
https://www.design-reuse.com/users/alert.php?u=$var->USER_ID&e=$var->USER_MAIL