D&R News Alert
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April 18th, 2024
In this issue
• Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
• Arm accelerates Edge AI with Ethos-U NPU and IoT reference design platform
• Ceva Wireless Platform IP Family Accelerates Enhanced Connectivity in MCUs and SOCs
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Welcome to the issue of April 18th, 2024 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Technology News
Products
 ❖ Movellus Aeonic Generate™ AWM3 [PLL] actively responds to droop and enables DVFS with advanced clock health and droop telemetry

Design Partner of the Week
GUC HBM3 & Die-to-Die / 2.5D Total Service Package
GUC
  • Complete Service Scope, including IP and CoWoS/InFO design
  • HBM3 up to 8.6G: N7, N5 and N3 silicon validated
  • GLink 2.3LL (5Tbps/mm) : N5 and N3 silicon validated
  • UCIe1.1 (32G/lane) : N3P TPO in Nov’23
  • Visit GUC at tsmc NA Technology Symposium (booth: 502)
Learn more...

Memory IP
Products
 ❖ Chuangfeixin Technologies OTP One Time Programmable IP Samsung 90CIS

Verification Platform
Synopsys
Silicon Lifecycle Management (SLM) Path Margin Monitor IP:
• Create timing margin heat map for functional paths in an SoC
• Achieve better PPA by leveraging silicon model calibration
• Provides key input for AVFS/AVS based optimization schemes

RISC-V
Internet of Things
Products
 ❖ Ceva-Waves Links100 - Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter)

GIGABIT ETHERNET PHY IP CORES
• White-Box Database Technology Transfer from Production SoC
• 1000BASE-T Full & Half Duplex IEEE 802.3 az/ab/u Compliant
• GDSII in 12nm, 14nm, 28nm + Porting Services available
• Ethernet MAC, PCS & TSN Digital IP Cores optional

Artificial Intelligence
Products
 ❖ OPENEDGES ENLIGHT Pro - 8/16-bit mixed-precision NPU IP
❖ Arm Ethos-U85

Automotive
JSPICE™ Simulation and Design Environment Available Now!
True Circuits • Quickly design, characterize, optimize and test complex circuits
• Run millions of simulations in parallel on local or cloud servers

Beta test for free >>

Multimedia
Green Electronics
Partner News
Business News





What they said at
IP SoC Conference 23

Jacek Hanke - CEO - Digital Core Design

Serge Maginot - CEO - Tiempo Secure

Bart Stevens - Senior Director of Product Marketing - Rambus, Inc.

Vince Wu - Sales Manager and Niraj Dengale - Senior Engineer - Andes Technology Corp.

Graeme Hickey - VP Engineering - PQShield

Chouki Aktouf - Co-Founder - Innova Advanced Technologies

Alexander Kovalevsky - Principal Engineer - NTLab

Welcome : Innovation in semi conductor industry
Gabrièle Saucier, CEO, D&R

Empowering Innovation in the Age of Custom Silicon
Eric Lalardie, Director, Arm Ltd.

Greening the Road Ahead: Revolutionizing the Automotive Industry with FD SOI Technology
Philippe Flatresse, Product Marketing, SOITEC

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