Welcome to the issue of July 8th, 2024 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.
3DIO PHY IP for TSMC N5
• Optimized for heterogeneous integration in 3D stacking
• Enabling designers the flexibility and scalability to accelerate multi-die integration
REGISTER:
If this newsletter was forwarded to you by a colleague, you can have it
sent directly to you at no cost. To register for D&R SoC News
Alert, go to: https://www.design-reuse.com/users/signup.php
UPDATE YOUR PROFILE /
UNSUBSCRIBE :
You are subscribed as $var->USER_MAIL and you receive this Alert
in html format.